[maciacco]

• New TF3Chip class added to handle chip creation (inspired by the Alpide class). The chip is now 300 um thick. Final real ASIC dimensions are now used
• Modules are now composed of 6x2 chips. Chips are separated by a 200 um gap. Modules along the stave are separated by a 200 um gap.
• The iTOF and oTOF length is updated taking into account the new mechanical constraints
• The stave volume now carries all the remaining material budget (expected 2% from services)
• Layer radius, length, and segmentation parameters (number of staves + tilt angle) are now configurable, enabling optimization studies on the detector layout
• The default chip segmentation now includes the end of column passive region